HEATKILLER® CPU Rev3.0

The HEATKILLER® CPU Rev3.0 represents the third generation of Watercool’s successful CPU coolers. Since its first release in 2001, the HEATKILLER® CPU Rev3.0 series has been constantly improved and adapted to new CPUs. Just like its predecessors, the third generation of the HEATKILLER® CPU Rev3.0 series sets new standards in performance, quality, and ease of mounting. The HEATKILLER® CPU Rev3.0 series has been developed for use in high-end systems.

The centralised inflow, combined with a jetplate and very fine cooling structure, gives excellent cooling performance. The cooler’s base plate adjusts geometrically to the CPU’s heatspreader, resulting in optimal contact between CPU and cooler. Despite the fine structure, flow resistance is exceedingly small. For optimal performance on quad core Processors with two separate dies (Intel Core2Quad), the cooler features a pluggable divider that allows parallel flow for both dies.

Its modular design allows both easy opening of the HEATKILLER® CPU Rev3.0 and adapting it to different mounting systems with little effort. Mounting plates and spare parts are separately available and guarantee yearlong operation.

The cooling structure is manufactured from pure copper, mounting plates and ornaments from stainless steel. The top is either made from black POM or pure copper, sealed against staining with a special clear varnish.

The HEATKILLER® CPU Rev3.0 is available in four versions, called Ni-Bl, Cu, LT and LC. The first three only differ optically, but provide the same performance. The LC is aimed at price conscious customers. It compromises some performance, but offers Watercool quality at a superior price.

 
With its sharp ROG style, the ROG Hybrid Thermal Solution is more than just a VRM cooler: it combines a 100% copper watercooling channel with electroplated nickel barbs and an integrated heatpipe, all wrapped in air-cooling fins. With the choice of both water-cooling or air-cooling, Hybrid Thermal Solution delivers the ultimate add-on to achieve that OC advantage.

 

Produktübersicht

Dimensions (LxWxH) Weight Threads Sealing Pressure tested Backplate Material
Ni-Bl version
59/59/17.5 400g G ¼ Zoll (DIN ISO 228-1) EPDM 75 (max. 150°C) 5 Bar Optional Inlay: stainless steel - chromated black, Top: electrolytic copper – nickel plated, Base plate: electrolytic copper, Mounting: stainless steel - chromated black
Copper version
59/59/17.5 400g G ¼ Zoll (DIN ISO 228-1) EPDM 75 (max. 150°C) 5 Bar Optional Inlay: stainless steel, Top: electrolytic copper, Base plate: electrolytic copper, Mounting: stainless steel
LC version
59/59/17.5 150g G ¼ Zoll (DIN ISO 228-1) EPDM 75 (max. 150°C) 5 Bar Optional Inlay: stainless steel, Top: POM, Base plate: electrolytic copper, Mounting: stainless steel
LT version
59/59/17.5 150g G ¼ Zoll (DIN ISO 228-1) EPDM 75 (max. 150°C) 5 Bar Optional Inlay: without, Top: POM, Base plate: electrolytic copper, Mounting: stainless steel
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